Abstract
A sharp cube textured Ni overlayer on Cu substrates has been developed for the manufacturing of long-length RABiTS-based coated conductor tapes. Using a low-cost, non-vacuum and easily scalable technique of electroplating, smooth, crack-free and continuous Ni overlayers were deposited on cube textured Cu substrates without any intermediate layers. In addition, sharp cube textured Sm-doped CeO2 buffer layers have been grown on the Ni-plated Cu substrates using pulsed laser deposition and found to exhibit in-plane and out-of-plane FWHM values of 6.50° and 5.25°, respectively. This electroplating process promises an efficient route for manufacturing Cu-based HTS coated conductors.
Original language | English (US) |
---|---|
Pages (from-to) | 107-111 |
Number of pages | 5 |
Journal | Superconductor Science and Technology |
Volume | 18 |
Issue number | 1 |
DOIs | |
State | Published - Jan 2005 |
ASJC Scopus subject areas
- Ceramics and Composites
- Condensed Matter Physics
- Metals and Alloys
- Electrical and Electronic Engineering
- Materials Chemistry