System design and packaging for an optically interconnected MCM switch for parallel computing

Jeremy Ekman; Fouad Kiamilev; Gregg Fokken; Mark Vickberg; Ping Gui; Michael Haney; Kevin Driscoll; Scott Sommerfeldt; Yue Liu; Premanand Chandramani; Marc Christensen; Barry Gilbert; Allen Cox; Xiaoqing Wang; Predrag Milojkovic; Brian Vanvoorst

System design and packaging for an optically interconnected MCM switch for parallel computing

Jeremy Ekman, Fouad Kiamilev, Gregg Fokken, Mark Vickberg, Ping Gui, Michael Haney, Kevin Driscoll, Scott Sommerfeldt, Yue Liu, Premanand Chandramani, Marc Christensen, Barry Gilbert, Allen Cox, Xiaoqing Wang, Predrag Milojkovic, Brian Vanvoorst

Physiology & Biomedical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Smart Pixel Arrays (SPAs) integrate two-dimensional arrays of optoelectronic devices (VCSELs and photodetectors) with state-of-the-art silicon VLSI circuits. This technology has the potential to improve the speed and density of computing and switching systems while reducing their size and power consumption. We describe a gigabit switch that integrates multiple SPAs onto an MCM and interconnects them using free-space optical interconnects. Parallel fiber optic data links are used to interface the switch to each compute node in a workstation cluster. The interdependence between electronic packaging, optical design, system architecture and circuit design is discussed.

Original language	English (US)
Title of host publication	Advances in Electronic Packaging; Manufacturing, Microelectronics Systems Systems and Exploratory Topics, Optoelectronics and Photonic Packaging
Pages	1643-1650
Number of pages	8
State	Published - Dec 1 2001
Event	Advances in Electronic Packaging - Kauai, Hi, United States Duration: Jul 8 2001 → Jul 13 2001

Publication series

Name	Advances in Electronic Packaging
Volume	3

Other

Other	Advances in Electronic Packaging
Country/Territory	United States
City	Kauai, Hi
Period	7/8/01 → 7/13/01

ASJC Scopus subject areas

Engineering(all)
Electrical and Electronic Engineering

Cite this

Ekman, J., Kiamilev, F., Fokken, G., Vickberg, M., Gui, P., Haney, M., Driscoll, K., Sommerfeldt, S., Liu, Y., Chandramani, P., Christensen, M., Gilbert, B., Cox, A., Wang, X., Milojkovic, P., & Vanvoorst, B. (2001). System design and packaging for an optically interconnected MCM switch for parallel computing. In Advances in Electronic Packaging; Manufacturing, Microelectronics Systems Systems and Exploratory Topics, Optoelectronics and Photonic Packaging (pp. 1643-1650). (Advances in Electronic Packaging; Vol. 3).

System design and packaging for an optically interconnected MCM switch for parallel computing. / Ekman, Jeremy; Kiamilev, Fouad; Fokken, Gregg et al.
Advances in Electronic Packaging; Manufacturing, Microelectronics Systems Systems and Exploratory Topics, Optoelectronics and Photonic Packaging. 2001. p. 1643-1650 (Advances in Electronic Packaging; Vol. 3).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Ekman, J, Kiamilev, F, Fokken, G, Vickberg, M, Gui, P, Haney, M, Driscoll, K, Sommerfeldt, S, Liu, Y, Chandramani, P, Christensen, M, Gilbert, B, Cox, A, Wang, X, Milojkovic, P & Vanvoorst, B 2001, System design and packaging for an optically interconnected MCM switch for parallel computing. in Advances in Electronic Packaging; Manufacturing, Microelectronics Systems Systems and Exploratory Topics, Optoelectronics and Photonic Packaging. Advances in Electronic Packaging, vol. 3, pp. 1643-1650, Advances in Electronic Packaging, Kauai, Hi, United States, 7/8/01.

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AU - Gui, Ping

AU - Haney, Michael

AU - Driscoll, Kevin

AU - Sommerfeldt, Scott

AU - Liu, Yue

AU - Chandramani, Premanand

AU - Christensen, Marc

AU - Gilbert, Barry

AU - Cox, Allen

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AB - Smart Pixel Arrays (SPAs) integrate two-dimensional arrays of optoelectronic devices (VCSELs and photodetectors) with state-of-the-art silicon VLSI circuits. This technology has the potential to improve the speed and density of computing and switching systems while reducing their size and power consumption. We describe a gigabit switch that integrates multiple SPAs onto an MCM and interconnects them using free-space optical interconnects. Parallel fiber optic data links are used to interface the switch to each compute node in a workstation cluster. The interdependence between electronic packaging, optical design, system architecture and circuit design is discussed.

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System design and packaging for an optically interconnected MCM switch for parallel computing

Abstract

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ASJC Scopus subject areas

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