System design and packaging for an optically interconnected MCM switch for parallel computing

Jeremy Ekman, Fouad Kiamilev, Gregg Fokken, Mark Vickberg, Ping Gui, Michael Haney, Kevin Driscoll, Scott Sommerfeldt, Yue Liu, Premanand Chandramani, Marc Christensen, Barry Gilbert, Allen Cox, Xiaoqing Wang, Predrag Milojkovic, Brian Vanvoorst

Research output: Chapter in Book/Report/Conference proceedingConference contribution


Smart Pixel Arrays (SPAs) integrate two-dimensional arrays of optoelectronic devices (VCSELs and photodetectors) with state-of-the-art silicon VLSI circuits. This technology has the potential to improve the speed and density of computing and switching systems while reducing their size and power consumption. We describe a gigabit switch that integrates multiple SPAs onto an MCM and interconnects them using free-space optical interconnects. Parallel fiber optic data links are used to interface the switch to each compute node in a workstation cluster. The interdependence between electronic packaging, optical design, system architecture and circuit design is discussed.

Original languageEnglish (US)
Title of host publicationAdvances in Electronic Packaging; Manufacturing, Microelectronics Systems Systems and Exploratory Topics, Optoelectronics and Photonic Packaging
Number of pages8
StatePublished - Dec 1 2001
EventAdvances in Electronic Packaging - Kauai, Hi, United States
Duration: Jul 8 2001Jul 13 2001

Publication series

NameAdvances in Electronic Packaging


OtherAdvances in Electronic Packaging
Country/TerritoryUnited States
CityKauai, Hi

ASJC Scopus subject areas

  • Engineering(all)
  • Electrical and Electronic Engineering


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