Multi-GHz VCSEL electrical packaging analysis

Stephen H. Hall, Wayne L. Walters, Larry F. Mattson, Barry K. Gilbert

Research output: Contribution to journalConference articlepeer-review

7 Scopus citations


This paper briefly discusses some of the major problems associated with multi-GHz (i.e., > 1 GBPS) VCSEL packaging. Spice simulations for the TO-56 laser can are presented and compared to measured laboratory data for model verification. Spice models were used to determine frequency limitations associated with the TO-46 and TO-56 laser cans. The lessons learned from the analysis of the TO-46 and TO-56 cans were used to design and model a conceptual VCSEL package, dubbed OPAL (Optical Package for Advanced Lasers), capable of operation to data rates as high as 4.8 GBPS. The modeling techniques used to match the TO-46 and TO-56 time domain and frequency domain simulations to measurements were extrapolated to create a model of OPAL and evaluate it at high frequencies.

Original languageEnglish (US)
Pages (from-to)605-611
Number of pages7
JournalProceedings - Electronic Components and Technology Conference
StatePublished - Jan 1 1996
EventProceedings of the 1996 IEEE 46th Electronic Components & Technology Conference, ECTC - Orlando, FL, USA
Duration: May 28 1996May 31 1996

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering


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