High-frequency performance of GE high-density interconnect modules

T. R. Haller, B. S. Whitmore, P. J. Zabinski, B. K. Gilbert

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations


An effort to determine the high-frequency electrical characteristics of the HDI (high-density interconnect) process and validate models and analytical tools is described. There were seven different designs fabricated, five with only passive structures and two with both passive and active structures. These coupons were designed with many different line structures in order to determine the electrical characteristics of HDI at high (>500-MHz) frequencies. A few of the structures used on the coupons and their respective electrical performances are discussed. The analytical tools derived from basic transmission line theory appear adequate to explain observed values of insertion loss, reflection loss, and crosstalk. In addition, the measurements confirmed the commonly accepted values for the electrical parameters of the GE HDI process (dielectric constant, loss tangent, and electrical resistivity). The crosstalk measurements demonstrate that sufficient isolation exists for practical system designs up to frequencies of 9 GHz in the stripline configuration, and even in the less-tolerant microstrip configuration good isolation is obtained without use of excessive spacing or guard conductors. The major limitation at the higher frequencies appears to be the insertion loss, which approaches 10 dB in some of the longer-length lines considered.

Original languageEnglish (US)
Title of host publicationProceedings - Electronic Components Conference
PublisherPubl by IEEE
Number of pages8
ISBN (Print)0818626607
StatePublished - Jan 1992
EventProceedings of the 42nd Electronic Components and Technology Conference - San Diego, CA, USA
Duration: May 18 1992May 20 1992

Publication series

NameProceedings - Electronic Components Conference
ISSN (Print)0569-5503


OtherProceedings of the 42nd Electronic Components and Technology Conference
CitySan Diego, CA, USA

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering


Dive into the research topics of 'High-frequency performance of GE high-density interconnect modules'. Together they form a unique fingerprint.

Cite this