Enhancements to the Non-Invasive Current Estimation Technique Through Ground Isolation

Chad M. Smutzer, Jordan R. Keuseman, Christopher K. White, Clifton R. Haider, Barry K. Gilbert

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Techniques for predicting or measuring the dynamic current of a high-performance integrated circuit have proven useful when applied in theory. However, the practical application of such methodologies in the lab is much more challenging. Test equipment imperfections have significant influence on the dynamic and static voltage measurement accuracy and thereby impede accurate prediction of chip load current. This paper empirically addresses the presence of ground loops in the measurement system and demonstrates appropriate isolation techniques to resolve the two-channel oscilloscope voltage measurements necessary for accurate load current calculation. In addition, these findings are correlated with simulations by adding oscilloscope and cabling parasitic inductance and resistance to simulation models, which further demonstrate the importance of ground isolation.

Original languageEnglish (US)
Title of host publicationEPEPS 2021 - IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781665442695
DOIs
StatePublished - 2021
Event30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021 - Austin, United States
Duration: Oct 17 2021Oct 20 2021

Publication series

NameEPEPS 2021 - IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems

Conference

Conference30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021
Country/TerritoryUnited States
CityAustin
Period10/17/2110/20/21

Keywords

  • Ground Isolation
  • Ground Loop
  • Load Current Calculation
  • Oscilloscope
  • Power Delivery
  • Voltage Measurement

ASJC Scopus subject areas

  • Safety, Risk, Reliability and Quality
  • Electronic, Optical and Magnetic Materials
  • Hardware and Architecture
  • Electrical and Electronic Engineering

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