Wave Model Solution to the Ground/Power Plane Noise Problem

Guang Tsai Lei, Robert W. Techentin, Paul R. Hayes, Daniel J. Schwab, Barry K. Gilbert

Research output: Contribution to journalArticlepeer-review

144 Scopus citations


In this paper, we describe the development of a theoretical field-based or “wave” model which we are employing in an attempt to characterize the ground/power plane (e.g., the Vcc plane) structure of a printed wiring board (PWB) or multichip module (MCM). A brief development of the model is presented, followed by simulation results and insight into the noise phenomena. A test structure and electrical measurements are used to confirm the correctness and applicability of the model.

Original languageEnglish (US)
Pages (from-to)300-303
Number of pages4
JournalIEEE Transactions on Instrumentation and Measurement
Issue number2
StatePublished - Apr 1995

ASJC Scopus subject areas

  • Instrumentation
  • Electrical and Electronic Engineering


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